Reflow-Löttechnik von SMDs aus der Sicht des Anwenders = Brasage avec refusion de CMS; point de vue de l'utilisateur = Reflow soldering of SMDs; the user's viewpointJILLEK, W.Verbindungstechnik in der Elektronik. Internationales kolloquium. 1986, pp 23-26Conference Paper

Techniques for soldering surface mounted devices to printed circuit boards = Technique de brasage tendre de composants sur des cartes de circuits imprimésBRIERLEY, C. J; CONSIDINE, L; PEDDER, D. J et al.1984, Num 7, pp 25-30, issn 0263-0060Article

Dampfphasen-Loetverfahren = Vapour-phase-soldering1985, Vol 35, Num 4, pp 37-38, issn 0036-7257Article

Perfluoropolyethers ― The most versatile fluids for vapour phase reflow soldering = Perfluoropolyéthers ― Les fluides les plus performants pour le brasage tendre avec refusion en phase vapeurBRIGGS, S.1984, Num 7, pp 6-12, issn 0263-0060Article

Resist reflow process for arbitrary 32 nm node patternPARK, Joon-Min; AN, Ilsin; OH, Hye-Keun et al.Proceedings of SPIE, the International Society for Optical Engineering. 2008, pp 69233A.1-69233A.10, issn 0277-786X, isbn 978-0-8194-7108-6Conference Paper

Analysis of measurement systems and DOE for reflow soldering process in SMTBUENO, Ana Carolina; PAULILO SHIKI, Maira; DE LIMA, Valdemir Ronaldo et al.Proceedings - Electrochemical Society. 2004, pp 233-238, issn 0161-6374, isbn 1-56677-416-0, 6 p.Conference Paper

Solder bumping via paste reflow for area array packagesBENLIH HUANG; NING-CHENG LEE.IEEE/CPMT International Electronics Manufacturing Technology Symposium. 2002, pp 1-17, issn 1089-8190, isbn 0-7803-7301-4, 17 p.Conference Paper

Reflow soldering of SMDs on printed circuit boards from the application viewpoint = Brasage par refusion de composants montés en surface sur plaquette de circuit impriméJILLEK, W.1986, Num 11, pp 39-41, issn 0263-0060Article

Increasing solder joint reliability of leaded surface mounted components = Augmentation de la fiabilité des joints brasés de composants de circuits intégrésDIERKE, J. H.1984, Num 7, pp 13-24, issn 0263-0060Article

Soldering of surface mounted devices : new tasks and their solutions = Brasage tendre des composants montés en surface: nouveaux problèmes et leurs solutionsSTRAUSS, R.1986, Num 10, pp 21-23, issn 0263-0060Article

Thermal oxidation study on lead-free solders of Sn-Ag-Cu and Sn-Ag-Cu-GeSANG WAN CHO; HAN, Kyul; YEONJIN YI et al.Advanced engineering materials (Print). 2006, Vol 8, Num 1-2, pp 111-114, issn 1438-1656, 4 p.Article

Reliability of lead-free solder interconnects: A reviewTONAPI, Sandeep; GOPAKUMAR, Sunil; BORGESEN, Peter et al.Proceedings. Annual Reliability and Maintainability Symposium. 2002, pp 423-428, issn 0149-144X, isbn 0-7803-7348-0, 6 p.Conference Paper

Inexpensive process for Flip Chip manufacturingMALYSZ, K; SZENDIUCH, I.SPIE proceedings series. 2001, pp 736-740, isbn 0-8194-4317-4Conference Paper

Popcorning in PBGA packages during IR reflow solderingMCCLUSKEY, P; MUNAMARTY, R; PECHT, M et al.Microelectronics international. 1997, Vol 42, Num JAN, pp 20-23, issn 1356-5362Article

A knowledge-based thermal profile identification advisor for surface mount PCB assemblyWU, C.-H; SRIHARI, K; MCLENAGHAN, A. J et al.International journal, advanced manufacturing technology. 1996, Vol 11, Num 5, pp 343-352, issn 0268-3768Article

Notes on the shape of fused solder coatings of metallized holes in printed beards = Etude de la forme des revêtements de métal d'apport de brasage tendre déposés dans les trous de circuits imprimésKLEIN WASSINK, R. J.1985, Num 8, pp 5-7, issn 0263-0060Article

Development of method to model surface of reflowed square microlens for image sensorKIM, S.-M; CHOI, M; KIM, H et al.Electronics Letters. 2008, Vol 44, Num 7, pp 492-493, issn 0013-5194, 2 p.Article

The effect of lead-free solder paste on component placement accuracy and self-alignment during reflowLIUKKONEN, Timo; NUMMENPÄÄ, Pekka; TUOMINEN, Aulis et al.Soldering & surface mount technology. 2004, Vol 16, Num 1, pp 44-47, issn 0954-0911, 4 p.Article

Annotated tin whisker bibliography and anthologyGALYON, George T.IEEE transactions on electronics packaging manufacturing. 2005, Vol 28, Num 1, pp 94-122, issn 1521-334X, 29 p.Conference Paper

Sn-Zn Lead-free solder applied to notebook personal computerSUZUKI, Motoji; MATSUOKA, Hiroshi; KONO, Eiichi et al.SPIE proceedings series. 2001, pp 298-303, isbn 0-8194-4317-4Conference Paper

Accelerated popcorn testing of high solder-reflow crack resistant molding compoundsTUBBS, T. R; GALLO, A. A.Microelectronics and reliability. 1998, Vol 38, Num 4, pp 665-669, issn 0026-2714Article

Design and Fabrication of High Numerical Aperture and Low Aberration Bi-Convex Micro Lens ArrayTSAI, Jhy-Cherng; CHEN, Ming-Fong; YANG, Hsiharng et al.Symposium on design, test, integration and packaging of MEMS-MOEMS. 2008, pp 174-176, isbn 978-2-35500-006-5, 1Vol, 3 p.Conference Paper

Effects of reflow on wettability, microstructure and mechanical properties in lead-free soldersGUO, F; CHOI, S; LUCAS, J. P et al.Journal of electronic materials. 2000, Vol 29, Num 10, pp 1241-1248, issn 0361-5235Conference Paper

Montage en surface = Surface mount technologyANDRE, F.1987, Num 83, pp 10-16, issn 0336-7436Article

Umschmelzen von bestückten Leiterplatten = Méthodes de refusion lors du brasage de plaquettes munies de leurs éléments = Reflow soldering of complete printed circuit boardsRAHN, A.Weichlöten in Forschung und Praxis 1986. Hochschulkolloquium. 1986, pp 57-65Conference Paper